2019.B.1.5. New Developments in Radiation-hardened solutions for CubeSats

Author(s)

Ross Bannatyne (1)

  1. VORAGO Technologies, U.S.A.

Session

B.1

Keywords

IC, packaging, MCU, microcontroller

Abstract

This paper discusses new radiation-hardened Integrated Circuit (IC) developments for CubeSat On-Board-Computers (OBCs). It is possible to increase the likelihood of CubeSat mission success by using radiation-hardened components judiciously in the design with consideration to the hardware budget. As CubeSats become more sophisticated, it is becoming more challenging to layout the circuit to accommodate all of the integrated circuit functionality that is desired in the system. New developments in chip integration and IC packaging for CubeSats that address this challenge will be discussed.

Presentation

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